EDAPS 2026 Tutorials
Optimization of the Transmission Characteristics for Next-Generation High-Frequency High-Speed Interconnect Components
Prof. Ding-Bing Lin, Electronic and Computer Engineering Department, National Taiwan University of Science and Technology
Tutorial II
Where Physics Meets AI: A Physics-Informed Neural Paradigm for Signal and Power Integrity
Sourajeet Roy, Global Indian Institute of Technology (IIT) Roorkee
Tutorial III
Heterogenous Integration
Arun Chandrasekhar, Intel Corporation
Tutorial IV
TBD
Ram Achar, Department of Electronics, Carleton University
Tutorial V
Modeling Electronic Systems for SI/PI: From Physics-Based Modeling to Machine Learning
Riccardo Trinchero, EMC Group, Department of Electronics and Telecommunications, Politecnico di Torino
Tutorial VI
Machine Learning Meets Macromodeling: Physics-Aware System Identification of Passive and Delayed Electronic Systems
Tom Dhaene & Yens Lindemans, Ghent University - imec