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EDAPS TUTORIALS
Tutorial 1
Moderator:
Madhavan swaminathan, Georgia Tech
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Integral Equation Methods for the Electromagnetic Analysis of Interconnect Networks: State of Art and Recent Advancements
Shashwat Sharma and Piero Triverio
University of Toronto
Tutorial 2
Moderator:
Thong Nguyen,University of Illinois
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High-Speed Next Generation SI Challenges
Tutorial 3
Moderator:
Arun Chandrasekhar, Intel
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System Scaling using Waferscale Processors
Tutorial 4
Moderator:
Madhavan Swaminathan,Georgia Tech
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A Bridge Connecting Worst-Case and Statistical Eye Estimation
Pei-Yang Weng, Tzong-Lin Wu,
National Taiwan University
14:40 - 14:50
Day 1 Wrap Up
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Chair:
Madhavan Swaminathan, Georgia Tech
- Delivering Power to Modern Microprocessors
Kaladhar Raddhakrishnan
Intel
Session 1: Design and Characterization
Chair:
TBD, TBD
- T-I.1. A Novel Spire Clip-type Pogo Connector Design with High Electrical and Thermal Reliability [7]
Keunwoo Kim*, Keeyoung Son*, Seokwoo Hong*, Joungho Kim*, Jinyoung Kim+
*KAIST,
+KET
- T-I.2. Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics [15]
Hyunwook Park*, Joonsang Park*, Gapyeol Park*, Daehwan Lho*, Boogyo Sim*, Hyungmin Kang*, Taein Shin*, Seongguk Kim*,
Seonguk Choi*, Seongmin Choi+, Jinyoung Kim+ and Joungho Kim*
KAIST,
+KET
- T-I.3. Novel Low Cost Launch for Measuring Via-to-Cavity coupling [32]
Fadi Deek, Melinda Piket-May, Eric Bogatin
University of Colorado at Boulder
- T-I.4. Effect of Liquid Crystal Polymer on High-speed Connector Transmission Properties [19]
Yu Bi+, Shitao Liu+, Bi Yi+ , Guoqi Zhou*, Zhongyuan Lu*,
*AVIC Jonhon Optronic Technology,
+ZTE Corporation
- T-I.5. Design and Characterization of a Metamaterial Microstrip Line with Increased Effective Permittivity [57]
Kaya Pi, Xiaofei Xu
Shanghai University
12:40 - 14:20
Session 2: Advanced Modeling and Simulation Techniques
Chair:
Hanzhi Ma, ZJUI
- T-II.1. Metamodel-based prediction of On Resistance for microelectronic power switches [22]
Georgian Nicolae*+, Andi Buzo+, Christian Feuerbaum+, Cristian Diaconu+, Horia Cucu*, Georg Pelz+, Corneliu Burileanu*
*University Politehnica of Bucharest,
+Infineon Technologies AG Neubiberg
- T-II.2. Decision Feedback Equalizer (DFE) Taps Estimation with Machine Learning Methods [62]
Bobi Shi*, Yixuan Zhao*, Hanzhi Ma+, Thong Nguyen*, Er-Ping Li+, Andreas C. Cangellaris* and Jose Schutt-Aine*
*University of Illinois Urbana Champaign,
+ZJU-UIUC Joint Institute, Zhejiang University
- T-II.3. Comparison of Invertible Architectures for High Speed Channel Design [63]
Osama Waqar Bhatti*, Oluwaseyi Akinwande*, Nikita Ambasana*, Xianbo Yang+, Pavel Roy Paladhi+, Wiren Dale Becker+, Madhavan Swaminathan*
*Georgia Institute of Technology,
+IBM Systems
- T-II.4. Statistical Sensitivity Analysis in Distributed Circuits using Compact Polymorphic Polynomial Chaos Surrogates [33]
Mohd. Yusuf, Sourajeet Roy
Indian Institute of Technology Roorkee
- T-II.5. A Fast method to predict the Voltage Droop for Fully Integrated Voltage Regulators in Microprocessors [59]
Amit Kumar, Srinivasan Govindan, Srikrishnan Venkataraman
Intel Technology India Pvt. Ltd, Bangalore, India
14:30 - 15:30
Session 3 - Antenna Design
Chair:
Meisong Tong, Tongji Unviversity
- T-III.1. Combining Electromagnetic Bandgap (EBG) Surface in High Gain and Low Back Radiation Antenna Design [20]
Chun-Cheng Wang, Hung-Chih Lin, Ming-Yuan Huang, Lih-Tyng Hwang
National Sun-Yat Sen University
- T-III.2. The Development of Compact Patch Antenna Array with High Angular Resolution for 77GHz FMCW Radar Applications [40]
ZhiGang Wang**, WeiHao Li*, Hongli Peng*, Changyuan Liu**, Xing Liao*
*Shanghai Jiao Tong University,
**Guangdong Communications & Networks Institute
- T-III.3. A High Isolation Antenna Array with Simple Feedings for Miniaturized 35GHz Radar Applications [43]
Shiyu Sun*, Hongli Peng*, Zhigang Wang**, Changyuan Liu**, Hong An Zhou*
*Shanghai Jiao Tong University,
**Guangdong Communications and Networks Institute
15:30 - 15:40
Day 2 Wrap Up
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10:10 - 10:40
Keynote Presentation
Chair:
Jose Schutt-Aine, University of Illinois
Keynote Title
Rajen Murugan
Texas Instruments
10:50 - 12:30
Session 4: Power Integrity
Chair:
Xu Chen, University of Illinois
- W-I.1. Innovative Power Integrity Analysis and Post-Silicon Co-relation for HSIOs [11]
Mukesh Moorthy, Manjunath Jayasimha
Intel
- W-I.2. Impact of On-Die Inductance from top metal power delivery routings in HSIO & Ethernet [31]
Siddhesh Arote, Manjunath Jayasimha
Intel
- W-I.3. Power Integrity analysis and solution for PCIE-Gen5/6 Phy [35]
Manjunath Jayasimha, Mukesh Moorthy
Intel
- W-I.4. Frequency Domain Characterization Voltage Mode Buck SMPS for Power Distribution Network [60]
Michael Chang, Simon Kao, Stephen Chu, Bryant Hsu, Mark Ciou, Choppy Lin, Robby Ho,
HTC
- W-I.5. Matrix-Based Evolutionary Approach for Optimization of Decoupling Capacitors [61]
Akash Jain, Heman Vaghasiya, Jai Narayan Tripathi
Indian Institute of Technology, Jodhpur
12:40 - 14:40
Session 5 - Signal Integrity
Chair:
TBD, TBD
- W-II.1. Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) [4]
Seongguk Kim, Taein Shin, Hyunwook Park, Daehwan Lho, Keeyoung Son, Keunwoo Kim, Joonsang Park, Seonguk Cho, Jihun Kim, Haeyeon Kim, Joungho Kim
KAIST
- W-II.2. Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface [12]
Taein Shin, Hyunwook Park, Keunwoo Kim, Seongguk Kim, Keeyoung Son, Kyungjune Son, Gapyeol Park, Joonsang Park, Seonguk Choi, Joungho Kim
KAIST
- W-II.3. Optimized Crosstalk and Impedance Design for HBM3 Channels in InFO [6]
Kuei-Ju Lin, Ruey-Beei Wu
National Taiwan University
- W-II.4. Modeling and Analysis of Cu-CNT Composite Through Glass Vias in 3D ICs [54]
Ajay Kumar, Rohit Dhiman
NIT Hamirpur
- W-II.5. A Physical Verification Methodology for 3D-ICs Using Inductive Coupling [8]
Tatsuo Omori, Kota Shiba, Atsutake Kosuge, Mototsugu Hamada, Tadahiro Kuroda
The University of Tokyo
- W-II.6. DDR RF Interference in Fan-Less SoC Design [10]
BoonPing Koh, SunYe E, Gaurav Hada, Asmah Truky
Intel
15:00 - 15:40
Session 6: Microwave Applications
Chair:
Rohit Sharma, IIT Ropar
- W-III.1. Electromagnetic Detection of Dielectric Cylinders by the Bat Algorithm [36]
Xin Zhang+, Chunxia Yang+, Meisong Tong*,
*Tongji University,
+Shanghai Normal University
- W-III.2. Wireless Power Transfer Technologies for Powering Multiple Sensor Nodes [46]
Kexue Cui, Mengfei Chen, Libo Qian
Ningbo University
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