Tutorial III

Arun Chandrasekhar works at Intel India as a Sr. Principal Engineer addressing server product packaging using the above-mentioned technologies. He has been with Intel India since 2004. He obtained his B.E. from College of Engg., Guindy, Chennai in 1997 & his M.Tech from DESE, IISc, Bangalore in 1999. He obtained his PhD from IMEC / KU Leuven Belgium in 2004. He spent the summer of 2003 as a co-op at IBM TJ Watson Research centre, NY, USA.