Delivering Power to Modern Microprocessors
Dr. Kaladhar Radhakrishnan,
Dr. Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He has played a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise are in integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award. He has authored four book chapters, over 40 technical papers in peer reviewed journals, and has been awarded 35 US patents. Kaladhar joined Intel in 2000 after he received his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign.
Multiphysics System Co-Design Modeling: The Evolutionary Design Verification Methodology to Ensure First-Pass IC Design Success
Dr. Rajen Murugan,
Dr. Rajen Murugan specializes in developing complex analog and mixed-signal IC packaging multiphysics system co-design modeling and analysis methodologies. He is a Distinguished Member of Technical Staff (DMTS) with Texas Instruments, Inc. He currently has 20 patents (24 pending) and has published over 50 papers in IEEE peer-reviewed journals and conferences. Dr. Murugan holds a Ph.D. in Applied Electromagnetics. He is currently an Affiliate Assistant Professor with the University of Washington, a Senior Member of IEEE, Chair of the IEEE EPS Dallas Chapter, and Co-Chair of the IEEE Dallas Section (R5).