Bhyrav Mutnury is a Senior Fellow at AMD, part of Technology and Engineering division where he is responsible for designing next generation high-speed interfaces. Prior to this, Dr. Mutnury was a Senior Distinguished Engineer at Dell Technologies. He received his Doctor of Philosophy degree in Electrical Engineering in 2005 from the Georgia Institute of Technology, Atlanta, GA. Dr. Mutnury has authored more than 100 publications in various conferences and journals. Dr. Mutnury has 300 issued patents and another 50 in the pipeline. He is currently an IEEE Fellow and the recipient of IEEE EMC Technical Achievement Award.

Dr. Rajen Murugan specializes in developing multiphysics system co-design simulation and modeling methodologies for advanced IC packaging and systems. He is currently a Distinguished Member of the Technical Staff (DMTS) with Texas Instruments, Inc., where his work focuses on the electrical, thermal, and mechanical co-design challenges that arise in next-generation semiconductor packaging. He holds 46 granted patents, with an additional 98 currently under review at the USPTO, and has published over 75 papers in peer-reviewed IEEE journals and conferences, reflecting a sustained research contribution to the electronics packaging community. He earned his Ph.D. in Applied Electromagnetics from the University of Manitoba, Canada, where he built the foundation for his later work in multiphysics modeling and simulation. Beyond his industry role, Dr. Murugan is an Affiliate Assistant Professor with the University of Washington Electrical Engineering Department and a Distinguished Lecturer for IEEE EPS, through which he shares his expertise with academic and professional audiences worldwide. He also serves as an Associate Editor for IEEE Transactions on CPMT and is an IEEE Fellow. He founded the IEEE EPS Dallas Chapter and currently serves as Chair of the IEEE Dallas Section (Region 5), continuing his long record of leadership within the IEEE community .