EDAPS
EDAPS

EDAPS

EDAPS

EDAPS
EPS


The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia-Pacific region to share the recent progress of design, modeling, simulation and measurement related to the electrical issues arising at the chip, package and system levels. Covering the paper presentations, industry exhibitions, workshops and tutorials, EDAPS 2024 will be held at the Taj Yeshwantpur, Bangalore, India, December 17-19, 2024.

Papers should be submitted electronically in two-column and three-page PDF file format through the EDAPS website (www.edaps.org). A Microsoft Word template is available on the symposium website. Hardcopy submissions will NOT be accepted. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Non-compliant manuscripts will not be considered for review.

DEADLINES

  1. Prospective authors should submit a three-page manuscript by August 31, 2024.
  2. Notification about acceptance will be given by September 30, 2024.
  3. Accepted papers will be reproduced as-is in the Conference Proceedings.

For a PDF version of the call for papers, please click here.

The symposium will consist of oral and poster presentations. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.

Conference Topics

  1. 3D-ICs/TSVs/Interposers/Heterogeneous Integration
  2. Testing on 3D-IC and SiP
  3. Multi-physics Simulation Techniques
  4. Design and Modeling for High-speed Channels
  5. Electronic Packages, SiP / SoP
  6. IC and Package Level EMC
  7. RF/mm-wave Packages
  8. Power Electronic Packages
  9. Advanced Simulation Tools and CAD
  10. Electrical Design of Flexible Devices & Sensing
  11. Electrical Design for 5G Wireless Communication
  12. Substrate Technology for Packages & PCBs
  13. 2-D Materials for 3D-ICs and SiP
  14. Electrical Machines, Automation, Instrumentation and Control, Mechatronics and Robotics
  15. Smart Grid, Renewable Energy, Energy Efficiency and Storage Technologies
  16. Power Systems and Power Electronics
  17. Digital Signal and Image Processing, Logic Design and Embedded systems
  18. AI, Machine Learning and IoT Applications
  19. Communications Theory, Networking, Mobile and Wireless Communications
  20. Engineering solutions to UN SDGs, Climate Change and Circular Economy

Deadline: August 31, 2024

Submission Format: 2 column, 3-page, PDF format only.

Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review.

Location: Taj Yeshwantpur, Bangalore, India

Exhibits: EDAPS-2024 will be exciting forum for vendors to demonstrate their state-of-the-art-tools to the attendees. Interested vendors can contact the conference administration for more details.

For more information, please contact: admin@edaps.org