EDAPS

EDAPS


EDAPS

EDAPS





EDAPS


EDAPS



EDAPS

EPS



EDAPS

MOST



MEA



Welcome to EDAPS!

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization. This symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials.

The southern city of Kaohsiung is Taiwan's largest port, its second-largest city and center of the country's heavy and petrochemical industries. Despite this, it is a modern urban landscape of airy cafes, wide streets, waterside parks, public transport, bicycle lanes and cultural venues that have embraced and re-imagined the city's manufacturing past. There are also two swimming beaches within the city area, and 1000 hectares of almost-pristine forest right on its doorstep.

EDAPS is sponsored by the IEEE Electronic Packaging Society.

EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 16-18 in Kaohsiung. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.