Keynote 2 Presentation

Abstract - Transistor/chip scaling has reached the point of diminishing returns and is becoming more complex and expensive at each node. Advanced packaging technologies show promise by bridging the gap in the "More than Moore" Era. However, advanced packaging technologies present unique challenges for traditional package design verification tools and methodologies. Complex integration exacerbates multiphysics (e.g., electrical, thermal, mechanical) and multidomain (chip-package-PCB system) coupled interactions. As such, without a paradigm shift in the traditional design verification modeling approach, potential business impacts are highly likely (viz costly re-spins, increased design cycle time, and time-to-market). Coupled multiphysics and system co-design (MSC-D) is emerging as the renewed modeling methodology to ensure first-pass design success. In this presentation, a few real-life design examples in the areas of high-voltage current sensing, high-current DCDC converters, mmWave radar sensing, and ultrasonic imaging systems will be presented that showcase implementation of MSC-D methodology. Challenges and opportunities in multiphysics system co-design are also discussed.

Dr. Rajen Murugan specializes in developing complex analog and mixed-signal IC packaging multiphysics system co-design modeling and analysis methodologies. He is a Distinguished Member of Technical Staff (DMTS) with Texas Instruments, Inc. He currently has 20 patents (24 pending) and has published over 50 papers in IEEE peer-reviewed journals and conferences. Dr. Murugan holds a Ph.D. in Applied Electromagnetics. He is currently an Affiliate Assistant Professor with the University of Washington, a Senior Member of IEEE, Chair of the IEEE EPS Dallas Chapter, and Co-Chair of the IEEE Dallas Section (R5).