EDAPS

EDAPS


EDAPS

EDAPS





EDAPS


EDAPS



EDAPS

EPS



EDAPS

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EDAPS-2019 - Sponsorship Opportunities

EDAPS (Electrical Design of Advanced Packaging and Systems) is the premier symposium in Asian area to discuss IC design, SiP/SoPpackaging, EMI/EMC, and EDA tools for advanced 3-D IC and packaging design. EDAPS is sponsored by the IEEE Electronics Packaging Society (EPS).

During the last sixteen years, the IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium has evolved into a forum of exchange on the latest research and developments in the field of microelectronics system-level integration. Engineers from academia and industry worldwide convene every year to discuss the most important challenges in system-level design, modelling and simulation.

The Conference will be held at the Grand HiLai Hotel, Kaohsiung, Taiwan

EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full-day conference and workshop, to be held during December 16-18 in Kaohsiung. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.in Kaohsiung, Taiwan.

There are five different sponsorship packages available. Each level of sponsorship provides a different level of company exposure.

Sponsorship Packages

  • Platinum - NT$300,000
  • Gold - NT$200,000
  • Silver - NT$100,000
  • Basic - NT$50,000

Sponsorship information (in Mandarin)

Sponsorship Choices - Benefits

To become a sponsor for EDAPS-2019, send request to:edaps-2019@emlab.illinois.edu