Tutorial III

Abstract - This tutorial covers predictive modeling methodologies in designing semiconductor IC products to meet stringent electromagnetic compatibility (EMC) regulatory standards for critical safety end applications (e.g., automotive, space, and industrial). The material is delivered by leveraging the pedagogical approach of the 3W's (Why, When, and What) to 1H (How). Whenever appropriate, the impact of predictive modeling will be demonstrated on real-world IC and package/system designs. The learning objectives are multifold - a comprehensive understanding of EMC modeling fundamentals, selecting the optimal modeling approach based on the problem at hand, and the ability to interpret the modeling result. Finally, the benefits of system-level EMC predictive modeling will be discussed when implemented early in the design flow to achieve high-performance, cost-effective EMC-compliant products.

Rajen Murugan specializes in developing multiphysics simulation and modeling methodologies for advanced IC packaging and systems. He is currently a Distinguished Member of the Technical Staff (DMTS) with Texas Instruments, Inc. He has 36 granted (US and Canada) patents and 95 under review at the USPTO. He has published over 60 papers in peer-reviewed IEEE journals and conferences. Dr. Murugan holds a Ph.D. in Applied Electromagnetics from the University of Manitoba, Canada. He is an Affiliate Assistant Professor with the University of Washington EE Department, a Distinguished Lecturer for the IEEE Electronics Packaging Society (EPS), an Associate Editor for the IEEE Transactions on CPMT journal, a Senior Member of IEEE, the founder of the IEEE EPS Dallas Chapter, and the current Chair of the IEEE Dallas Section (Region 5).