EDAPS

Tutorial III


Monday, December 12, 2022,
12:10-12:50 PM, China Standard Time

Universal Chiplet Interconnect Express- an Overview
Ramaswamy Parthasarathy, Intel

Abstract - UCIe is an emerging standard for die to die interconnects. The talk focusses on the importance of die to die interconnects, their specific requirements and challenges and how UCIe intends to address them. High level details in terms of physical and protocol will be discussed. Concluding with remarks on future of die to die interconnects and how it may shape up the Moore’s law extensions.




Dr. Ramaswamy Parthasarathy (Partha) is a Senior Principal Engineer at Intel Corporation. His area of expertise is in signal/power integrity. His interests include high speed design and analysis for boards and packages.