EDAPS
Tuesday, December 15

Session T-I: Novel Interconnects

10:40 - 12:20 - China Standard Time

Chair: Joungho Kim, KAIST


  • T-I.1. Novel Bondwire and Microstrip Internetion Structures between Chip-to-Chip for Applications Up to 130GHz [40]
    Ming-Ming Li, Hong-Li Peng, Ya-Bin Li, Chen Chen, Qing-Mian Wan
    Shanghai Jiao Tong University
  • T-I.2. Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs [52]
    Keeyoung Son, Subin Kim, Shinyoung Park, Hyunwook Park, Keunwoo Kim, Taein Shin, Minsu Kim, Kyungjune Son, Gapyeol Park, Seungtaek Jeong, Joungho Kim
    KAIST
  • T-I.3. An Improved Method of Finding Complex Permittivity of Lossy Liquids [88]
    Ruei-Jhe Liu, Chiu-Chih Chou, Tzong-Lin Wu
    National Taiwan University
  • T-I.4. Investigation of Effects of Virtual Ground in Three Types of Coupled Line with Mixed-mode Stimuli [93]
    Lih-Tyng Hwang*, Chun Cheng Wang*, Ming Yuan Huang*, Hung-Chih Lin*, Chien-Chan Huang+
    *National Sun Yat-Sen University,
    +Yuan Ze University
  • T-I.5. Temperature and Dielectric Surface Roughness dependent Performance Analysis of Cu-Graphene Hybrid Interconnects [106]
    Rahul Kumar*, Bhawana Kumari+, Somesh Kumar**, Manodipan Sahoo +, Rohit Sharma*
    *IIIT Ropar,
    +IIT Dhanbad,
    **ABV-Indian Institute of Information Technology & Management
  • Live Q&A
    Panel of Presenters