EDAPS
Tuesday, December 15

Session T-III: Poster Session I

14:30 - 15:00 - China Standard Time

Chair: TBD


  • T-III.1. Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory [1]
    Kota Shiba, Tatsuo Omori, Mitsuji Okada, Mototsugu Hamada, Tadahiro Kuroda
    The University of Tokyo
  • T-III.2 NEXT & FEXT Prediction using Hybrid 2D-3D Solver for Fast Electromagnetic Analysis [101]
    Manoranjan Sahoo and Dipanjan Gope
    Indian Institute of Science
  • T-III.3. Sub-picosecond Skew Matching [10]
    Minh Quach, Nur Devnani, Mark Hinton, Ravi Kaw
    Broadcom
  • T-III.4. On Die SSN Methodology for High Speed IO [3]
    Vinod Arjun Huddar
    Rambus Inc
  • Live Q&A
    Panel of Presenters